The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 1978
Filed:
Sep. 04, 1975
Jury Vladimirovich Naidich, Kiev, SU;
Galina Alexeevna Kolesnichenko, Kiev, SU;
Nikolai Stepanovich Zjukin, Kiev, SU;
Boris Dmitrievich Kostjuk, Kiev, SU;
Stanislava Stanislavovna Shaikevich, Kiev, SU;
Yaroslav Feodosievich Motsak, Kiev, SU;
Vitaly Pavlovich Fedulaev, Moskovskaya oblast, Ljuberetsky raion, SU;
Nikolai Alexandrovich Kolchemanov, Ljubertsy Moskovskoi oblasti, SU;
Valentin Mikhailovich Ugarov, Ljubertsy Moskovskoi oblasti, SU;
Viktor Vasilievich Losev, Moscow, SU;
Mark Simonovich Drui, Leningrad, SU;
Alla Alexandrovna Lavrinovich, Leningrad, SU;
Dmitry Fedorovich Shpotakovsky, Leningrad, SU;
Stanislav Viktorovich Chizhov, Leningrad, SU;
Other;
Abstract
This invention relates to methods for soldering metals to superhard man-made materials such as diamond, boron nitride and hexanite and to soldering agents therefore. A method is proposed which comprises applying a metallizing coating to the soldering surface of the materials based on diamond and/or boron nitride, the materials to be joined by soldering being exposed to a temperature sufficient to bring about adequate adhesion of the metallizing coating to the materials to be soldered, and subsequently soldering the metal with the material bearing the metallized coating by use of soldering agents featuring ductile properties and melting points in the range up to 1,000.degree. C, whereby, in accordance with the invention, the metallizing coating is constituted by metals showing high adhesive activity toward materials based on diamond and boron nitride and accounting for from 3.0 to 65 percent by weight of the coating and by metals showing poor oxidizability which account for the balance. The soldering procedure is effected in air under a layer of a liquid flux designed for soldering metals with metallic spelters. Also proposed is a copper-tin-titanium soldering agent which, in accordance with the invention, has the following composition, wt.%: