The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1978
Filed:
Sep. 20, 1976
Limin Hsueh, Bedford, MA (US);
Robert A Hard, Still River, MA (US);
Donald H Davidson, Bedford, MA (US);
Ray V Huff, Acton, MA (US);
Kennecott Copper Corporation, New York, NY (US);
Abstract
An environmentally compatible, industrially safe, and potentially economic means for recovering copper and/or nickel from deep-seated deposits without resorting to extensive underground development. A two-phase ammoniacal leach solution containing oxygen bubbles is forced under high pressure through an injection hole several thousand feet deep into a leaching interval of a deep lying deposit containing copper or nickel or copper and nickel. The two-phase leach solution travels through the leaching interval of the deep lying deposit and is pumped out of withdrawal holes spaced apart from the injection hole. The two-phase leach solution under high pressure (more than 500 psi) penetrates the deposit through cracks, fissures and fractures, leaching copper and/or nickel along the way. Under a controlled pressure gradient, the leaching solution migrates over a period of time to receiving holes from which the pregnant leaching solution is withdrawn. The pregnant solution is then processed for recovery of copper or nickel or copper and nickel before it is returned to an injection hole. A method and apparatus for producing the two-phase leach solution and for maintaining a system in which the gas bubbles are able to penetrate the deposit is disclosed. Also disclosed are various parameters, such as hole spacing techniques, hole completion techniques and stimulation techniques.