The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 1978
Filed:
Jun. 14, 1976
Edwin J Luetzow, Northfield, MN (US);
TelTec, Incorporated, Farmington, MN (US);
Abstract
A sealed enclosure means for an electrical switching array and a method of preparing such an enclosure, with the switching array employing a plurality of generally rigid terminal contact pins which extend outwardly from a wall of the enclosure. The wall through which the terminal contact pins extend has a plurality of slots formed therein, with the slots having contact pin engaging edges. The material from which the wall is fabricated through which the terminal contact pins extend is generally resilient, and the slots which are formed therein to receive the contact pins have a width which is less than the pin thickness so as to cause the slot edges to temporarily form a lip seal about the surface of the pin. The terminal contact pins are then heated so as to cause the thermoplastic resilient material to flow to form a seal about the periphery of the contact pin. The temporary lip seal protects the structure against intrusions of solder flux which is used in preparation for the solder dip operation, while the subsequently formed seal (due to flow of thermoplastic material) protects against intrusions of cleaning solvents and the like which are utilized subsequently to remove the residual solder flux.