The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1978
Filed:
May. 23, 1977
Kazushige Hayashi, Ibaraki, JP;
Iwao Fujimoto, Waki, JP;
Toshio Morishita, Iwakuni, JP;
Norihiro Minemura, Ibaraki, JP;
Norio Yoshida, Ibaraki, JP;
Kiyotaka Ozaki, Iwakuni, JP;
Takanori Shinoki, Matsuyama, JP;
Teijin Limited, Osaka, JP;
Abstract
A suede-like raised woven fabric which comprises: warp yarns; weft yarns, each being a single twist filament yarn or a loopy textured filament yarn consisting of a bundle of fine fibers; and an elastic polymer applied to the fabric. The bundle of fine fibers consists of a raised portion having an average monofilament denier of from 0.05 to 0.4 and an unraised portion having an average monofilament denier of above 0.4 but not exceeding 0.8. The raised woven fabric is prepared by weaving a fabric using as weft yarn a single twist filament yarn or a loopy textured filament yarn comprising hollow composite fibers, each composed of at least four alternately arranged components of fiber-forming polyester and fiber-forming polyamide which are mutually adhered side-by-side encompassing a hollow space and extend along the longitudinal axis of the fiber to form a tubular body, and dividing the hollow composite fibers into fine fibers to form a bundle of fine fibers consisting of raised and unraised portions by a raising operation. The raised woven fabric has a high density and excellent uniformity of the raised fine fibers, and has excellent suppleness, surface abrasion and pilling resistances.