The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1978
Filed:
Jul. 26, 1977
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 68 ; 357 81 ;
Abstract
A semiconductor device is disclosed wherein a semiconductor pellet is attached on a heat sink of a flange, leads are connected to corresponding electrodes of the semiconductor pellet directly or through wires, the semiconductor pellet and portions of the leads are sealed by resin mold on the flange and top outer periphery of the heat sink is formed with a projection to prevent peel-off of the resin mold and cracking of the resin mold which would otherwise occur due to difference between coefficients of thermal expansion of the flange and the resin mold.