The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 1978

Filed:

May. 26, 1976
Applicant:
Inventors:

Koji Nomaki, Yokohama, JP;

Yoshihito Saoyama, Yokohama, JP;

Ryo Tamamura, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
7513 / ; 75151 ; 7516 / ; 7517 / ;
Abstract

Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180.degree. C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60% Cd and 0.05 - 10% by wt Zn with the simultaneous application of vibration, preferably ultrasonic vibration.


Find Patent Forward Citations

Nomaki, Koji. (1978). Solder alloys for soldering difficultly solderable material (U.S. Patent No. 4106930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4106930

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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