The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 1978
Filed:
Jan. 12, 1977
Applicant:
Inventors:
Toshiaki Murakami, Hino, JP;
Shigeru Waku, Tokyo, JP;
Akira Demura, Tokorozawa, JP;
Toshiaki Fujishiro, Tokyo, JP;
Assignees:
Nippon Telegraph & Telephone Public Corporation, Tokyo, JP;
Nippon Tsushin Kogyo Kabushiki Kaisha, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
106 46 ; 106 733 ; 106 7332 ; 106 734 ; 106 735 ; 428428 ; 428446 ;
Abstract
A process for producing ceramics to be used as substrates and packages of semiconductor devices, which having a thermal expansion coefficient close to that of silicon used as chip or wafer material of large scale integrations and a mechanical strength and thermal conductivity equal to those of alumina, wherein zircon and clays such as kaolin, ball clay and the like and an additive of one of Li.sub.2 O, TiO.sub.2 and ZnO and another of CoO, Co.sub.2 O.sub.3, Co.sub.3 O.sub.4 and MgO are mixed, molded and fired.