Composite multifilament superconductors

Abstract

A composite multifilament superconducting structure is provided, which includes an elongated substrate-carrying, longitudinally-directed, sputtered discrete filament of an A-15 type intermetallic superconductor. In a preferable procedure, a plurality of spaced, generally longitudinal grooves are formed on the surface of an elongated filamentary substrate, preferably a metal wire. The walls of the grooves on the substrate surface are shaped to undercut the curvilinear surface of the substrate located between two adjacent grooves so that at least some of the wall portions of the grooves are geometrically shadowed during the subsequent sputtering step in which a superconductor is sputtered onto the substrate. In particular, a film of a suitable superconducting intermetallic compound having A-15 crystalline structure, such as Nb.sub.3 Ge, is thereupon sputtered onto the grooved substrate and deposits at the bottom of the grooves and at the surface portions of the substrate between grooves. The shadowed wall portions remain substantially deposit-free so that the resultant spaced deposits extend as distinct lines or bands along the substrate to thereby constitute the superconductive filaments. A plurality of such substrates may, if desired, be consolidated into a further composite structure, by bundling the substrates and passing same through a molten metal. The resultant structure may then be sized to yield as a final product a composite of the substrates bearing the superconducting filaments in a surrounding matrix of the metal.