The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1978
Filed:
May. 09, 1977
Jerome J Kneifel, Columbus, NE (US);
John C Veburg, Columbus, NE (US);
Dale Electronics, Inc., Columbus, NE (US);
Abstract
A modular test tray is comprised of individual modules solidly detachably secured together and shorting straps for rapid and easy electrical connection between modules. Each module is comprised of two tuning fork shaped connector pins embedded in the module and capable of detachable mechanical and electrical engagement with the shorting straps. Two posts capable of receiving electrical components to be tested are also embedded in the module and electrically connected to the connector pins. The posts protrude from the top of the module while the connector pins are recessed in grooves on the bottom of the module. Shorting straps consisting of intermittent strips of electrical conducting material, the strips being of sufficient length to electrically connect only two connector pins of adjoining modules and spaced apart so as to electrically connect consecutive pairs of connector pins, allows a series electrical connection of the components to be tested. Shorting straps consisting of continuous electrical conducting material allow a parallel electrical connection of the components to be tested. The individual modules are selectively detachably mounted together to provide easy replacement of worn out modules and to allow variance of the test tray size to accommodate multiple lots sizes and value splits of components.