The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1978
Filed:
Dec. 09, 1976
Applicant:
Inventors:
Raymond Henry, Paris, FR;
Alain Chapard, Paris, FR;
Assignee:
Thomson-CSF, Paris, FR;
Primary Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
29583 ; 29580 ; 2957 / ;
Abstract
A process intended for combining the 'flip-chip bonding' technique with a method yielding diodes of very thin substrate forming mesa units or clumps etched out in a dielectric block embedding the semiconductor body. The process comprises, starting from a semiconductive wafer, a double mesa etching and a double lapping, each of them carried out on each side of the wafer, due to a thick dielectric layer and a thick metallic support respectively brought in at the right moment.