External drive coil magnetic bubble package

Abstract

A magnetic bubble domain package suitable for single or multiple chips in which the coil assembly for producing the rotating magnetic field necessary for bubble movement and logical operations to be performed on these chips comprises a pair of coils wound on a magnetic body in orthogonal relationship with respect to each other which is located external to said chip or chips in order to reduce coil size and power requirements. The package employs an open bias field magnet assembly which comprises an open-ended tubular housing constructed of shielding material and having permanent magnets mounted therein with soft magnetic plates disposed on the permanent magnets. An alternate embodiment employs only a single permanent magnet and a single soft magnetic plate secured within the tubular housing, and uses the magnetic body of the coil assembly as part of the bias field assembly. The chip substructure which is served by this bias field assembly employs a metal plate as an image current producer to increase the uniformity of the drive field. An interconnect member constructed of a thin film of insulating material with electrical conductors disposed thereon is used to provide the interface between the external signal leads of the package and the magnetic bubble domain chip.