Hot melt adhesive pumping apparatus having pressure-sensitive feedback

Abstract

A high-capacity pumping apparatus for handling thermoplastic materials such as hot melt adhesives is provided which is capable of safely and efficiently pumping materials heretofore thought to be impractical because of the high flow and melting points thereof. The apparatus preferably includes a heated pressure plate, an elongated, tapered, material-conveying barrel connected thereto, a complementally tapered, axially shiftable auger with the barrel, and pressure-responsive means coupled to the auger for automatically shifting the auger relative to the barrel in order to temporarily decrease pumping efficiency during momentary slowdowns in material flow so that dangerous pressure buildups within the apparatus are avoided, and for returning the auger to its normal pumping position when adequate material flow resumes. The shiftable barrel and auger pumping assembly is also coupled with counterbalancing mechanism for providing a constant opposing force against travel of the pumping assembly; this regulates and coordinates material pumping and precludes material loss and fouling of the pumping equipment caused by escape of material around the periphery of pressure plate during pumping. The device hereof also includes an SCR-controlled constant torque drive motor for the auger, a flexible material delivery conduit having a controlled, central resistance heating element therein, and barrel piercing structure for relieving the partial vacuum created within the barrel by virtue of pumping.