Support for hybrid substrate carrying electrical circuit patterns and

Abstract

A substrate carrying electrical circuit patterns and elements is supported in an upright position on a printed circuit board by a clip so as to restrict rotational movement of the substrate from that position when pins and plated through holes on the substrate and board are engaged. The clip comprises a body having a flat bottom for contacting one side of the board and a first-cylindrical peg depending from the bottom. Spaced-apart sections on one side of the body are in a common plane perpendicular to the bottom with a protrusion near the top of the body extending beyond this plane. A second-rectangular peg also extends from the one side of the body past the common plane, with the base of the second peg being in line with the flat bottom. A trough in the protrusion receives one edge of the substrate, with one side of the latter contacting the side sections in the common plane, and the opposing edge of the substrate being proximate the bottom of the body. When the pins are engaged in the plated through holes, the first peg makes a slip fit in a hole in the board to restrict rotational movement of the substrate.