The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 1978
Filed:
Mar. 02, 1977
Akitoshi Sugio, Omiya, JA;
Yukiya Masuda, Urawa, JA;
Toshihiko Kobayashi, Showamachi, JA;
Koichi Nakano, Tokyo, JA;
Tsukasa Sawai, Tokyo, JA;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JA;
Abstract
Epoxy resin is pretreated with an organic solvent such as furfuryl alcohol, methyl alcohol, ethyl alcohol, n-propyl alcohol, iso-propyl alcohol, formic acid, acetic acid, propionic acid, butyric acid, methyl formate, ethyl formate, propyl formate, methyl acetate, ethyl acetate, propyl acetate, methyl propionate, ethyl propionate, propyl propionate, methyl butyrate, ethyl butyrate, propyl butyrate, acetone, diethyl ketone, dipropyl ketone, methylethyl ketone, diisopropyl ketone, methylpropyl ketone, ethylpropyl ketone, acetonitrile and nitromethane as a pretreating solution, and the pretreated resin is then etched with an etching solution containing hydrogen peroxide or a persulfate and sulfuric acid, or the resin is pretreated with an organic solvent containing furfuryl alcohol, methyl alcohol, ethyl alcohol, n-propyl alcohol or isopropyl alcohol, and formamide or ethylene glycol, 1,2-propylene glycol or glycerine, and the pretreated resin is etched with an etching solution containing hydrogen peroxide and sulfuric acid to roughen the surface of the resin. A good adhesiveness is obtained between the surface of the resin and a film of metal when the resin is coated with a metal.