Multi-level socket for an integrated circuit

Abstract

An integrated circuit socket particularly directed towards dual-in-line package (DIP) type circuits provide multilevel mounting for such integrated circuits. the socket body is formed to receive the first circuit package while the second circuit package is disposed above the first. Metallic contact members are disposed in holes arranged to coincide with the electrical leads subtending from each circuit. Each contact member is formed with means to clean and receive the coincident electrical leads from the first and second circuits. Insertion of the leads into the contact member scrapes surface dirt and corrosion from the lead to insure metal to metal contact. Each contact member is formed to engage the socket preventing inadvertent removal of the contact member. The contact members are sufficiently long to extend through the socket and an associated printed circuit board to which they may be readily soldered by conventional means. In the one embodiment the socket is unitary and is formed with longitudinal protruding spacer members to separate it from the circuit board. In a second embodiment the socket is modular.