The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1978
Filed:
Feb. 10, 1977
Louis E Gates, Jr, Westlake Village, CA (US);
Hughes Aircraft Company, Culver City, CA (US);
Abstract
A flat pack or a platform type ceramic-metal package for housing large scale integrated (LSI) circuit wafers or hybrid circuits comprises a rectangular, square or circular, flat ceramic base metallized with a pattern of radial leads from the central portion of the package to its periphery. The leads pass out underneath a ceramic ring frame hermetically sealed to the base. The outside of the ring frame is metallized. Alternatively, flat-headed metal pins may be passed through the base. Hermetically brazed to the frame is a Kovar ring or sleeve. The electronic device is bonded inside the ring frame to the package base. Electrical connections from wafer or hybrid circuit pads to lead pads or pins within the ring frame are made by conventional wire bonding techniques. A ceramic lid with rim and the outer portion of its upper surface metallized is attached to the package by soldering to the Kovar ring.