The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1978
Filed:
Aug. 18, 1976
Hiroshi Kuroda, Katano, JA;
Matsushita Electric Industrial Co., Ltd., Kadoma, JA;
Abstract
A method of forming electrode wirings for semiconductors devices. A first photoresist pattern is formed on the surface to be provided with electrode wirings in the configuration of an inverse pattern to the electrode wirings, and on the top of this pattern-containing surface is vapor deposited, a conductor of electrode material. On the conductor layer, a second photoresist layer is applied. This photoresist layer is etched until only the upper surface of the part of the conductor layer located above the first photoresist pattern, is exposed, thereby forming a second photoresist pattern. Then, by etching the aforementioned conductor layer with this second photoresist patterns as the etching mask, only the part of the conductor layer which is not to constitute the electrode wirings is removed. By this method, thicker electrode wirings than those formed by the conventional lift-off method may readily be formed.