The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 1978
Filed:
Nov. 17, 1976
Vernon H Batdorf, Minneapolis, MN (US);
H. B. Fuller Company, St. Paul, MN (US);
Abstract
The disclosed method for forming an epoxy adhesive-bonded joint between a plurality of substrates is particularly well suited to an assembly line operation. The method involves forming an intimate mixture of the two components of a two-part adhesive system under conditions such that substantial curing will not occur until heat and/or pressure are applied. The application of heat and/or pressure for a short period of time initiates the curing reaction which will continue to completion under substantially normal ambient conditions. The initial bond strength is sufficient to hold mated substrates together with the bond strength increasing even when the curing process is completed under normal ambient conditions. For example, substrates can be coated with an intimate mixture of a two-part system suitable for use in this invention, stored for a period of time, mated on an assembly line under cure initiation conditions, and allowed to cure at normal room temperature and atmospheric pressure. Generally, conventional epoxy resins known in the art will work in the disclosed invention. The active hydrogen-containing curing agents or coreactants used in the disclosed invention are primary-amine terminated polyamides having a ball and ring softening point of 60.degree.-200.degree. C.