The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1978
Filed:
Mar. 28, 1977
Wolf-Dieter Ruh, Sindelfingen, DT;
Gerhard Trippel, Sindelfingen, DT;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Several tapered viaducts or through-holes of uniform size are simultaneously fabricated by etching in a dielectric plate or substrate. The viaducts, which are designed in particular for nozzles for ink jet printers, have identical orifice widths, irrespective of differences in the thickness of the substrate or dielectric plate or different etch rates in the various areas of the dielectric plate. The holes are first chemically pre-etched until the first hole is about to penetrate through the plate and subsequently sputter etching is applied until all holes have penetrated through the plate, whereby the dielectric plate provides the necessary sputter etch capacity on which a negative bias occurs.