Dynamic random access memory system

Abstract

An integrated circuit MOSFET dynamic random access memory is disclosed which utilizes a plurality of memory cells arrayed in rows and columns. One-half of the cells in each column are connected to a true digit line and the other half are connected to a complement digit line. The true and complement digit lines are each connected through a separate transistor, which functions as a varible resistance, to true and complement input nodes of a sense amplifier. The sense amplifier is comprised of a transistor connecting each input node to a latch node, with the gates of the transistors cross coupled to the opposite input nodes. The digit lines are precharged to equal voltages corresponding to V.sub.DD. When enabled by an address signal, a storage cell is connected to one of the digit lines at the same time a dummy cell is connected to the other line. As a result, one of the digit lines has a slightly higher voltage than the other. The first set of transistors permit the latching node to be very rapidly brought to ground in order to completely discharge the digit line having the lower voltage, while maintaining substantially the initial high voltage on the other digit line. The common gate nodes of the first transistors are precharged to the drain supply voltage when one of the true or complement digit lines in each column is low and then isolated to provide bootstrapping above V.sub.DD when the digit lines are subsequently precharged to the drain supply voltage of the system. The split digit lines are precharged from a common node through a first pair of transistors, with the common node being charged through a third transistor. The third transistor is turned off before the first pair of transistors to prevent noise in the drain supply voltage from resulting in uneven voltage precharges on the split data lines.