The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1977
Filed:
Jul. 26, 1976
Gerhard Johannes, Taunusstein, DT;
Erwin Gemmer, Falkenstein, DT;
Hans-Joachim Konig, Frankfurt am Main-Fechenheim, DT;
Gunter Reinhard, Frankfurt am Main-Schwanheim, DT;
Hoechst Aktiengesellschaft, Frankfurt, DT;
Abstract
An article comprising a metal substrate in the form of a pipe or a container, said substrate being coated with a hardened epoxy resin composition formed from (A) a solid epoxy resin based on epichlorohydrin and a component selected from the group consisting of (a) 4,4'-diphenylolpropane, (b) 4,4'-diphenylolmethane and (c) a combination of (a) and (b), (B) from 1 to 12% by weight based on the epoxy resin of at least one hardener for said epoxy resin selected from the group consisting of (d) compounds of formula ##STR1## wherein R is hydrogen or an alkyl group of 1 to 6 carbon atoms or an aromatic hydrocarbon residue with 6 to 10 carbon atoms, (e) compounds of formula ##STR2## wherein R is hydrogen or an alkyl group having 1 to 6 carbon atoms or an aromatic hydrocarbon residue with 6 to 10 carbon atoms and (f) an adduct of any one of compounds (d) and (e) to an epoxy resin with an epoxy equivalent weight of from 50 to 2000, (C) a flow agent, (D) a thixotropic agent and a process of coating such metal substrate by means of heating said substrate to a temperature above the melting temperature of the epoxy resin component of an epoxy resin coating composition and sufficient to cure the said epoxy resin and powder-coating the said epoxy resin composition onto the hot surface of the substrate to provide a substantially uniform coating thereon by immediate hardening without any further processing step by means of the heat capacity of the hot substrate.