The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 1977

Filed:

Jul. 12, 1976
Applicant:
Inventors:

Masahiro Oita, Kashiwara, JA;

Hyogo Hirohata, Neyagawa, JA;

Nobuhiro Hamasaki, Neyagawa, JA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
106-126 ; 427437 ;
Abstract

An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.


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