The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1977
Filed:
Jan. 05, 1976
Tzong Jeng Chu, Shimodate, JA;
Susumu Konii, Shimodate, JA;
Hitachi Chemical Company, Ltd., Tokyo, JA;
Abstract
A novel thermosetting resin, the thermoset resin obtained therefrom having such a thermal resistance that the temperature at which the thermoset resin is caused to show a weight loss of 6% by heating at a temperature elevation rate of 10.degree. C. per minute is at least 400.degree. C., is prepared by reacting a specific phenolic resin with a member selected from the group consisting of a silicic acid ester of the formula Si(OR).sub.4 wherein R represents alkyl or aryl and a mixture of a silicic acid ester of the formula as defined above and a titanic acid ester of the formula Ti(OR).sub.4 wherein R has the same meaning as defined above in the presence of an alkaline catalyst while keeping the reaction system in a molten state, to an extent that 20- 70 mole %, based on the phenol present in the starting system to be reacted with said member, of phenolic hydroxyl groups in terms of the amount of phenol, remain unreacted. The thus obtained novel resins of the present invention can be easily set or hardened in accordance with the ordinary manner; namely by mixing with a thermohardening agent such as hexamethylenetetramine and then heating, to give thermoset resins having a superior thermal resistance as compared with the conventional phenolic resins. In addition, the thermoset resins obtained from the novel resins of this invention are excellent in mechanical strength, electrical properties and luster of molded articles.