The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 1977

Filed:

Dec. 16, 1975
Applicant:
Inventors:

Hans Eschler, Munich, DT;

Rudolf Oberbacher, Munich, DT;

Assignee:

Siemens Aktiengesellschaft, Berlin & Munich, DT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
29 2535 ; 29594 ; 228121 ;
Abstract

An acousto-optical component or other high frequency and wide-band ultrasonic component comprises a piezoelectric transducer and a crystalline or glass sound medium which are bonded together by a multi-layer metal molecular adhesion bond. During fabrication, the surfaces of the piezoelectric body and the sound medium which are to be connected are first polished to a degree of smoothness which is well below that of a Newton ring. These surfaces are then completely cleansed and a first metal layer having a thickness of 0.5-2 nm is vapor deposited onto each the cleansed surfaces. Next, a second metal layer having a thickness of 5-20 nm is vapor deposited onto each of the first layers. The transducer is then applied, by molecular adhesion, to the sound medium. To form a strong and reliable bond, only moderate pressures of about 250 to 1500 psi are necessary. A metal layer having a thickness of 0.3-0.6 .mu.m is vapor deposited over an extending portion of the multi-layer bond as a terminal for connection to a high frequency supply. Subsequently, the transducer is ground to a desired thickness in order to obtain a desired resonant frequency and a second electrode is applied to another surface of the piezoelectric body for connection to the high frequency supply.


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