The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 1977
Filed:
Jun. 27, 1975
Richard C Chu, Poughkeepsie, NY (US);
Kevin P Moran, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method is provided for customizing the heat transfer from the walls of an electronic unit such as a semi-conductor chip or wafer by determining the required heat transfer characteristics of the units; drilling holes of a predetermined size and location in the walls of the unit with a high energy beam in accordance with the required heat transfer characteristics of the unit; immersing the unit in a suitable dielectric coolant so that nucleate boiling will start at approximately the desired wall temperature to obtain the required heat transfer from the unit, thereby providing a uniform wall temperature. A further aspect of the invention is the inclusion of a heater means located at or near the bottom of the heat transfer wall so that bubble generation can be started thereat, which bubbles wash the liquid from the downstream drilled holes or natural nucleation sites, thereby starting nucleate boiling when the required temperature is reached.