The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1977
Filed:
May. 13, 1976
Udo Lob, Eichenau, DT;
Fritz Scheidel, Munich, DT;
Siemens Aktiengesellschaft, Berlin & Munich, DT;
Abstract
A process for the production of semiconductor elements is set forth which includes metallizing a side of a large-area semiconductor wafer, having at least two zones of differing conductivity types, applying a soft-solder plate to the metallized side of said large-area wafer, bringing a perforated plate with a desired pattern of holes against said soft-solder plate, said perforated plate being formed of a material which does not form an alloy with said soft-solder plate, subjecting said perforated plate to a load while said soft-solder is heated to its melting temperature, cooling said soft-solder plate and removing it, and subjecting said large-area semiconductor wafer to a sand blast which is directed against the side coated with the solder metal until the large-area wafer has been divided up. The stream of the sand on the said blast may be as wide as the large-area wafer. The metal layer formed on the large-area wafer is preferably formed as two nickel layers and a gold layer.