The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 1977
Filed:
Oct. 29, 1976
Applicant:
Inventors:
Tsuyoshi Shimizu, Hinode, JA;
Katsuhiro Tabata, Kodaira, JA;
Assignee:
Hitachi, Ltd., , JA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
249 95 ; 249 83 ; 425116 ; 425127 ;
Abstract
A mold assembly for resin sealing for use in the manufacture of a semiconductor device etc., includes a pair of upper and lower molds. Elastic deformation parts adapted to be deformed in the direction of compression of the upper and lower molds with an object to-be-sealed, held therebetween, are provided on at least one of a cavity block of the upper mold and a cavity block of the lower mold. Grooves are provided in the surface of the cavity block formed with the elastic deformation parts.