The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 1977

Filed:

Sep. 08, 1975
Applicant:
Inventors:

Guenther Vorbach, Schwindegg, DT;

Siegfried Kuballa, Puchheim, DT;

Assignee:

Siemens Aktiengesellschaft, Berlin & Munich, DT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
29574 ; 29577 ; 29591 ; 29626 ;
Abstract

A method of producing a diode matrix disposed on a plug-in circuit board, for use as a character generator, in particular for a code generator of electronic teleprinters, or for a circuit board with optionally differing line configurations, in which the entire diode matrix is fabricated, irrespective of the number of actual diodes to be ultimately employed, whereby the maximum design number of diodes to be carried by the board are mounted and operatively connected to produce a complete operative diode matrix, disposing each diode in such relation with respect to the board that at least one of the electrical leads of such diode is sufficiently exposed for possible severance thereat, and thereafter programming the matrix to the desired characters to be transmitted by rendering unrequired diodes inoperative, severing at least one lead thereof or by removal of the particular diode. In one embodiment of the invention the diodes are positioned in a generally parallel relation with respect to the circuit board upon which they are to be mounted, whereby both of the electrical leads to the diode may, if desired, be severed to permit the removal of the diode from the matrix. In another embodiment the respective diodes are disposed at right angles to the general plane of the circuit board whereby the outermost lead of the diode is readily available for severance.


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