The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1977
Filed:
Jan. 19, 1976
Charles Grady Roberts, Plano, TX (US);
Wayne W Chan, Plano, TX (US);
Dean R Collins, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A disk shaped ceramic support has a mounting surface provided as a unitary part of the support with conductors extending generally outward from the mounting surface through the thickness dimension of the support, the outer ends of the conductive leads being connected to a ring of terminal leads. A charge coupled device (CCD) imager chip is secured to the mounting surface to leave a backside illumination surface of the chip unobstructed and electrical interconnections are made from terminal pads on the front surface of the chip to the ends of the conductive leads adjacent the mounting surface. A cover plate attached to the insulating support outwardly of the interconnections encloses the front surface of the chip. In a preferred structure the chip is mounted on an apertured molybdenum disk unitarily attached to the support with the illumination surface of the CCD chip facing the aperture. A peripheral tube flange can be brazed to the periphery of the insulating support and a tubular enclosure vacuum sealed to the tube flange for accommodating a photo-cathode source which faces the illumination surface of the imager chip. In a further embodiment, the front side of the chip is attached directly to a mounting surface provided by the insulating support itself, connections between the terminal pads on the chips and the conductive leads of the support being effected therough apertures in the support located adjacent corners of the chip.