The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 1977

Filed:

Mar. 13, 1975
Applicant:
Inventors:

Gerald M Leszyk, Rochester, NY (US);

Edward D Morrison, Rochester, NY (US);

Robert F Williams, Jr, Rochester, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264 22 ; 264132 ; 264160 ; 264166 ; 264236 ; 264297 ; 264299 ; 427 44 ; 427 54 ;
Abstract

Thin plastic parts which can have precise tolerances and can be of complex shape are prepared by casting a viscous radiation-curable composition onto a support, such as a moving web of polymeric material, in the shape of the desired part and then irradiating, for example with ultraviolet radiation or high energy electrons, to cause curing of the composition to a solid plastic. The radiation-curable composition is formulated with viscosity and flow characteristics which enable it to be cast in the exact shape of the part desired yet retain this shape during curing while supported only by the surface on which it has been cast. Plastic parts made by this method can be formed entirely of the radiation-curable composition by casting onto a web having a release surface from which the part can be stripped subsequent to curing or can be formed partially from a web material and partially from the radiation-curable composition by casting onto a web to which the composition will bond and subsequently cutting the web into discrete portions which include the cured composition.


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