The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 1977

Filed:

Dec. 19, 1975
Applicant:
Inventors:

George A Kupsky, State College, PA (US);

Douglas L Santchi, State College, PA (US);

Assignee:

Panel Technology, Inc., Lewistown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J / ; H01J / ; H01J / ;
U.S. Cl.
CPC ...
313217 ; 313220 ; 313318 ; 313332 ;
Abstract

There is disclosed an improved gas discharge display panel device and process of manufacturing same of the type wherein non-conductive thin glass support substrates for anode and cathode electrodes are joined together by a sealant in a spaced-apart assembly. Printed conductors connected to the anode and cathode electrodes extend through the seal area on the respective anode and cathode substrates, which conductors are dielectric coated extensions of the conductive material constituting the electrode. A conductive silver epoxy is extruded between the plates at each point where a conductor passes through the seal and a solid metallic conductor element is inserted in the conductive silver epoxy at each place on anode or cathode lead exits from the seal area. Thereafter, the silver conductive epoxy is cured to form a conductive adhesive bonding of the metal inserts in place and making very low resistance positive connections between each of the conductors extending through the seal area to external circuitry for the device. In another embodiment, the electrical conductors which lead through the seal to the anode electrodes are coupled to contact pads on the cathode electrode at a region disposed to the rear of the edge of the anode substrate, the cathode substrate extending beyond the edge of the cathode substrate and carrying the contact pads thereon. This permits the edge of the panel to be universally adaptable to inserted conductors as well as to adapt itself to edge connectors as in conventional printed circuit boards.


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