Wire-bonding equipment

Abstract

Wire-bonding equipment has jigs which may be secured on a mounting support whereat an electronic or other module may be loaded onto a jig and moved into a correct alignment observable on a television screen, and the jigs are transportable from the mounting support location to a positioning table location whereat successive jigs are automatically moved in a requisite manner to bring successive terminals of modules loaded thereon to a position for bonding of wires thereto by a simultaneously actuated wire-bonder unit, after which successive jigs are transported back to the mounting support to permit unloading of a wired module and loading of a new module. Since the disclosed equipment permits use of ultrasonic bonding means, and requires only simple, easily observable actions by an operator, the equipment is particularly suited to wiring of microelectronic modules.