The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 1977

Filed:

Nov. 03, 1975
Applicant:
Inventors:

Gene N Pantiga, San Jose, CA (US);

Robert M Allen, Mill Valley, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ;
U.S. Cl.
CPC ...
2042 / ; 204 15 ; 204206 ;
Abstract

A novel plated lead frame strip and a novel method and apparatus for selectively plating the strip is described. The strip comprises a plurality of identical lead frame sections. Each of the lead frame sections comprises a plurality of leads. Each lead has a lead tip. In the center of each section and surrounded by the lead tips is a die-attach pad. The apparatus comprises in combination three plating stations. Each of the three stations is provided for plating a predetermined part of each of the lead frame sections. In the first station, a means is provided for plating the tips and the pad of a lead frame section with a first predetermined metallic plating -- e.g., a gold or copper strike. In the second station, a means is provided for masking the tips and plating the pad only with a second predetermined metallic plating -- e.g., a gold finish. In the third station, a means is provided for masking the pad and plating the tips with a third predetermined metallic plating -- e.g., silver. The stations are arranged in such a fashion that all three may be plating simultaneously with each one plating its respective part in the desired plating sequence.


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