The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 1977

Filed:

Apr. 14, 1976
Applicant:
Inventors:

Walter W Harvey, Bedford, MA (US);

Myron R Randlett, Burlington, MA (US);

Karlis I Bangerskis, Walpole, MA (US);

Assignee:

Kennecott Copper Corporation, New York, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25C / ;
U.S. Cl.
CPC ...
204108 ; 2041 / ;
Abstract

An electrodeposition cell in which high quality metal such as copper is produced on bipolar electrodes at a high current density. The bipolar electrodes are arranged in series between a cathode and an anode. Current shields around the anode and cathode and each bipolar electrode prevent current bypass. Gas bubble tubes for continuously agitating the electrolyte across each face of the bipolar electrodes enable effective use of high current densities to electrowin or electrorefine a metal such as copper. Apparatus may include bipolar electrodes comprising a non-corrodible metallic substrate having a refinable metal such as copper on its anodic face. Current shields also prevent electrodeposition on unwanted areas of bipolar electrodes and end cathode. Method of electrodeposition with novel cell.


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