The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1977
Filed:
Feb. 17, 1976
Stephen Cassidy, Canton, MA (US);
Robert Baboian, Johnston, RI (US);
Raymond A Frechette, Woonsocket, RI (US);
Gardner S Haynes, Attleboro, MA (US);
John W Ross, Cumberland, RI (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A process for plating beryllium copper with an excellent electrically conductive material such as gold for use in high reliability applications wherein a heat treating step is employed after forming to yield a desired hardness spring temper comprising the steps of: providing a copper-rich surface on the beryllium copper; electroplating the copper-rich surface with a diffusion barrier preplate; heat treating the beryllium copper material to a desired temper; and electroplating the material with a high electrically conductive material. This process provides for a void-free, durable gold plate which can be produced by a continuous automated strip plating line before and after heat treating.