The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1977
Filed:
Jul. 16, 1975
Terry O Herndon, Carlisle, MA (US);
Jack I Raffel, Lexington, MA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Abstract
Lead connections and packaging for integrated circuits are formed by processing elongated ribbon arrays of integrated circuit dice in groups prior to cutting the ribbon along its length to free the discrete integrated circuit products. The ribbon is adhered to the base of an elongated channel having at least one leg containing implanted lead-in conductors arranged therein as an axial series of axial arrays of conductors. The axial arrays are aligned with the circuits on the ribbons and interconnections therebetween are formed as photolithographically defined conductive coatings on a top surface of the ribbon extending from bonding pads of the integrated circuit to exposed conductor ends at a top end(s) of the leg(s). The channel ribbon assembly is cut into discrete circuits after forming such interconnections for all the circuits of the ribbon as a group. Each array of lead-in conductors is packed in high density and fans out from the channel to an array of low density lead-out conductors which may be plugged into sockets or otherwise macroscopically treated.