The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 1977
Filed:
Apr. 29, 1974
Larry Ronald Stauffer, Camp Hill, PA (US);
AMP Incorporated, Harrisburg, PA (US);
Abstract
Packaging of electronic chips, such as light emitting diodes and the like, without the use of conventional flying leads and ultrasonic bonding is disclosed. The subject packaging and mounting of electronic chips is primarily intended for use with flat flexible cables and similar circuitry which is printed onto flexible insulator substrates. A portion of the circuitry on the insulator substrate is broken by a sharp instrument to form a break or slot in both the conductor and substrate. An electronic chip, such as a light emitting diode, is inserted edge wise into the slot with the opposing surfaces thereof in contact with the conductor of the circuit on either side of the slot. The mechanical friction between the chip and the edges of the slot are sufficient to hold the chip in place while maintaining satisfactory electrical contact.However, the chip can be bonded to the circuit by any known means including solder reflow, conductive epoxys and encapsulation with suitable material.