The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 1977
Filed:
Oct. 28, 1975
Lewis Brian Lerner, Linglestown, PA (US);
AMP Incorporated, Harrisburg, PA (US);
Abstract
A plating process system has been disclosed which provides for a strike bath, a low current density plating bath or a high speed plating bath, the last for production of electroplating deposits with current densities in excess of 200 ASF; additionally, the strike bath may be used with the low current density plating bath as a combination, or as another combination, the strike bath is with the high speed, high current plating bath; the advantages are a compatible strike and plating bath; nonstaining deposits; buffered pH operations; neutral pH; no free cyanide in bath; elimination of drag-in problems from a strike bath vessel to plating bath vessel; reduced drag-out from this bath; higher current density capability and higher current density for lower total initial concentration in solution when compared to commercial baths presently available; the deposits are especially useful for high purity integrated circuits and provide an alternate system to gold for microelectronic circuits without any increased operation requirements.