The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 1977

Filed:

Mar. 11, 1976
Applicant:
Inventors:

George R Hall, II, Euclid, OH (US);

Jack M White, Novelty, OH (US);

Roger L Krechmery, Mentor, OH (US);

Assignee:

Bailey Meter Company, Wickliffe, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L / ;
U.S. Cl.
CPC ...
7339 / ; 73 8 / ; 73420 ; 228124 ; 228179 ; 338-4 ;
Abstract

A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The holder assembly includes a Borosilicate glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by a eutectic alloy solder. In assembly, the Nickel-Iron holder is first brazed to the stainless Steel housing at a first temperature greater than the maximum non-destructive temperature of either the chip or the glass tube and the glass tube is then soldered to the Nickel-Iron holder at a lower temperature which will not destroy the chip or the tube holder.


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