The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1977
Filed:
Oct. 28, 1975
James R Mercer, Akron, OH (US);
The McDowell-Wellman Engineering Company, Cleveland, OH (US);
Abstract
A thermosetting injection molding machine includes an injector chamber, a distribution platen, four distribution nozzles, and a mold heating platen. A thermosetting material flows from the injector chamber to two crossed distribution chambers each of which extends from edge to edge completely through the distribution platen. Liquid coolant passages extend through the distribution platen along both sides of each of the distribution chambers. The distribution nozzles include cores which block the ends of the distribution chambers and which carry the thermosetting material through the mold heating platen to the mold. The distribution nozzles also include jackets having a greater coefficient of heat conductivity than the cores for maintaining all but the tip of the cores adjacent the mold at a temperature below the curing temperature of the thermosetting material. A removable mold for the machine includes a mold cluster adjacent each of the four distribution nozzles. The mold clusters each include a plurality of mold cavities and a runner for carrying the thermosetting material from its associated distribution nozzle to its associated mold cavities. By this arrangement, a multiple nozzle distribution system and a mold heating system are provided by the machine completely independently of the mold to simplify mold design.