The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 1977
Filed:
Oct. 02, 1975
Applicant:
Inventors:
Melvin Berkenblit, Yorktown Heights, NY (US);
See Ark Chan, Bronx, NY (US);
Joan B Landermann, Fishkill, NY (US);
Arnold Reisman, Yorktown Heights, NY (US);
Takeshi Takamori, Croton-on-Hudson, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B / ;
U.S. Cl.
CPC ...
65134 ; 65136 ; 106 52 ; 106D / ;
Abstract
A process for controlling the softening point and for providing a preselected softening point of solder glass which comprises bubbling oxygen-containing gas through a homogeneous melt of a solder glass containing copper oxide at a temperature and oxygen partial pressure predetermined to provide the desired preselected softening point of the solder glass and for a time sufficient to achieve equilibrium of the reaction Cu.sub.2 O+1/2O.sub.2 .revreaction.2CuO.