The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 1977
Filed:
Feb. 21, 1975
Gay Leon Dybwad, Emmaus, PA (US);
Bell Telephone Laboratories, Incorporated, Murray Hill, NJ (US);
Abstract
Bonds are made between two work pieces by using foils exploded by electrical energy typically stored in a large capacitor. To increase the uniformity of the bond area, a foil having at least one slit cut in the direction of current flow is used. The foil strips separated by the slit are attracted together by the pinch effect when current is applied, tending to eliminate loss of foil through a jetting action during explosion. Platings are made by pressing the foil between the work piece and a plastic layer to which the foil does not adhere. In both bonding and plating, the capacitor is charged with energy sufficient to bring the foil just to its boiling point. This 'tuning' is more efficient and minimizes heat and blast effects that might otherwise damage a small work piece.