Thermally controlled electronic system package

Abstract

A plug-in module, for supporting such electronic devices as an LSI circuit wafer, hybrid electronics, and/or discrete components, includes a ceramic base, the electronic devices mounted on one side of the base, a corrugated cooling fin bonded to the other side of the base, a printed circuit board secured to the far side of the cooling fin, a terminal strip connector at the base edge, a crossover electrically interconnecting the two module sides, and a supporting slotted frame onto which the ceramic base and printed wiring board are bonded. The terminal strip connector is secured to the frame with screws. Circuit leads from the ceramic base are soldered directly to the terminal strip connector and also are interconnected to the terminal strip by means of soldered crossover leads and vertical conductor lines on the printed circuit board. If the module's electronic function so requires, further electronic devices may be placed on the printed circuit board. Cooling air for the module is introduced from a unit chassis plenum through the slots passing into one edge of the frame so that air traverses through the fin to cool the package and by conduction, a circuit wafer or other heat dissipating devices mounted therein, and the air emerges through the slots in the opposite frame side. Modules are designed to be inserted into closely spaced card guides which may be provided with apertured strips for controlling the rate of flow of coolant passing through the fin.