The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1977
Filed:
Aug. 05, 1974
William J Knutson, Tamarac, FL (US);
Daniel M Smith, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A radio frequency power amplifier includes a flat ceramic substrate having a conductive coating on one side and a plurality of conductors on the other side arranged in a predetermined pattern. At least one conductor is connected through the substrate to the conductive coating which is grounded. A plurality of components are connected to the conductors on the substrate including a transistor die, chip capacitors, air wound coils, a chip inductor and resistors. Conductors on the substrate are of a configuration to provide spiral inductors, some of which are connected in series with the air wound coils, which have tuning segments adapted to be severed to control the inductance after assembly of the components. Conducting bridges are also provided to join conductors which are spaced from, and insulated from, an intermediate conductor. The substrate is provided in an electrical and heat conducting housing having a base to which the conducting coating is electrically and mechanically secured, and three conducting side walls about the substrate. The fourth side includes terminals connected to a plurality of conductors for applying input signals and operating potential to the amplifier, and for deriving output signals therefrom. A conducting plate closes the top of the housing to completely enclose and shield the substrate and components thereon.