The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1976
Filed:
Sep. 13, 1973
Kaoru Furukawa, Otsu, JA;
Shinichiro Seki, Otsu, JA;
Takashi Akiyama, Otsu, JA;
Singo Ueda, Otsu, JA;
Hideo Ikeda, Otsu, JA;
Toyo Boseki Kabushiki Kaisha, Osaka, JA;
Abstract
A hot melt adhesive which comprises a copolyamide consisting essentialy of (1) .epsilon.-caprolactam, (2)(a) hexamethylenediamine and (b) at least one straight chain, saturated aliphatic dicarboxylic acid having 6 to 20 carbon atoms in a substantially equimolar ratio and (3)(a) at least one of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine and (b) at least one straight chain, saturated aliphatic dicarboxylic acid having 6 to 20 carbon atoms in a substantially equimolar ratio, the proportion of [A] the constituent unit essentially consisting of the component (1), [B] the contituent unit essentially consisting of the components (2)(a) and (2)(b) and [C] the constituent unit essentially consisting of the components (3)(a) and (3)(b) therein being within a pentagon circumscribed by the lines connecting the points P (82/17/1), Q (52/47/1), R (0/65/35), S (0/50/50) and T (86/7/7) in the graph as shown in FIG. 1 of the accompanying drawing (the numerals in the parenthesis following P, Q, R, S and T indicating the molar percentages of the constituent units [A], [B] and [C], respectively).