The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1976
Filed:
Oct. 10, 1975
Kenneth C Litt, Silver Spring, MD (US);
Pace Incorporated, Silver Spring, MD (US);
Abstract
A solder removal device has air under pressure supplied thereto. The device has a hollow handle in which is disposed a Venturi structure for creating a vacuum where the vacuum is applied through a solder collection chamber also disposed in the handle and a solder extraction tube in communication with the solder collection chamber and extending outside of the handle. The air discharged from the Venturi structure is directed around the solder collection chamber and out an opening in the handle whereby heat is removed from the solder collection chamber, the heat having been generated by hot air and solder sucked into the chamber. Hence, the device may be used continuously for solder extraction without discomfort to the operator's hand. A rotatable cover is also provided in the handle for either partially or completely blocking the air discharged from the Venturi structure whereby air is blown outwardly through the suction tube so that a hot air jet suitable for melting solder is effected when the discharge air is partially blocked and a high intensity jet is effected suitable for blowing away loose solder or the like when the discharge air is completely blocked. A trigger is optionally provided on the handle. The trigger actuates valve means disposed within the device so that upon actuation thereof, the air under pressure supplied to the device is applied to the Venturi structure.