The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1976
Filed:
Nov. 17, 1975
Hiromu John Kuno, Palos Verdes Peninsula, CA (US);
Yu-Wen Chang, Los Alamitos, CA (US);
Mario Siracusa, Fountain Valley, CA (US);
Hughes Aircraft Company, Culver City, CA (US);
Abstract
An active millimeter wave integrated circuit including a thin non-metallic waveguiding layer mounted on an image plane and having an opening therein which exposes a given area of the image plane. An active solid state device, such as a millimeter wave diode, is mounted on the exposed area of the image plane, and millimeter wave energy is coupled to and from the device into the waveguiding layer by way of both a metallic ribbon (or wire) bonded to the active device and a connecting metallization pattern atop the waveguiding layer. This metallization pattern may assume various geometries corresponding to functional components such as low-pass filters, resonators, stepped or tapered metallized transitions, and the like, and also provides the desired impedance matching and efficient energy coupling between the active device and the waveguiding layer. A dc operating bias can be applied to the device by connecting one power supply terminal to the metallization pattern and one power supply terminal to the ground or image plane. The image plane also serves as an excellent solid mechanical support and heat sink for the integrated circuit.