The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1976
Filed:
May. 01, 1975
Laura B Zielinski, Plantsville, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process for forming an embedded interconnection metallurgy system on a substrate by (1) forming a first layer of an organic thermosetting polymerized resin material on the substrate, (2) forming a second overlying layer of a material that is soluble in a solvent that does not appreciably affect the material of the first layer, (3) forming a third layer resistant to reactive ion etching in O.sub.2 on the second layer, (4) masking the third layer to define the pattern of the desired metallurgy, (5) removing the exposed areas of the third layer, (6) reactive ion etching the resultant exposed areas of the first and second layers, (7) depositing a conductive metal with a thickness approximately matching the thickness of the first layer, and (8) exposing the substrate to a solvent selective to the material of the second layer thereby removing it and the overlying portions of the conductive metal layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile