The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1976
Filed:
May. 06, 1975
Takehiro Kakizaki, Yokohama, JA;
Yasuharu Kubota, Fujisawa, JA;
Sony Corporation, Tokyo, JA;
Abstract
An electrode structure includes a pin that extends through a hole in a fragile substrate, such as a thin, glass plate, and makes contact with a conductive layer on one surface of the plate. The structure includes a first metallic adherent layer on that portion of the conductive layer and a second metal layer on the exposed surface of the first metal layer. The hole extends through the conductive layer and both of the metal layers. The first metal layer is adherent to the conductive layer and consists of iron, chromium, or nickel, for example, deposited on the conductive layer. The second metal layer is a fixative for the first layer and is wettable by soft solder. It consists of a noble metal from the group consisting of gold, silver, platinum and paladium. The pin has a head larger than the cross-section of the hole and a surface that is wettable by soft solder. A ring of soft solder encircles the pin and is solidified into joining relationship between the surface of the pin and the adjacent surrounding surface of the second metal layer to form a hermetic seal and an electrical connection between the pin and the second metal layer. The solder ring may be placed on the pin as a separate element, and its temperature may be raised to the molten state by heat treatment of the entire assembly, after which the solder resolidifies upon cooling.