The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 1976

Filed:

Oct. 01, 1974
Applicant:
Inventors:

Saburo Takamiya, Amagasaki, JA;

Masaharu Hama, Amagasaki, JA;

Akihiro Kondo, Amagasaki, JA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
148188 ; 29583 ; 156-8 ; 156 17 ; 156-3 ; 357 56 ;
Abstract

An SiO.sub.2 film doped with an impurity is formed on at least one portion of a surface of a semiconductor wafer. The wafer is selectively etched after a protective film for selective etching is disposed into a predetermined pattern on the SiO.sub.2 film. The impurity included in the SiO.sub.2 film can be diffused into the wafer to form a PN junction in the latter. Then the wafer is selectively etched until that surface of the wafer to which the PN junction is exposed is bevelled.


Find Patent Forward Citations

Loading…